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Wire bonding in microelectronics

Wire bonding in microelectronics

by George G. Harman

1997Electronic packagingFailureReliabilityDefectsSemiconductors
0.0
Open Library
Open Library

Themes & subjects

Electronic packagingFailureReliabilityDefectsSemiconductorsProduction control
First published 1997

Author

George G. Harman

First published

1997

Pages

290

Read time

≈ 7h

Editions

1

Language

English

Publisher

McGraw-Hill

ISBN

0070326193

Where to buy

TR
Amazon Bookshop

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