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Solder paste in electronics packaging

Solder paste in electronics packaging

by Jennie S. Hwang

1989Design and constructionPrinted circuitsSolder pastesSurface mount technologyElectronic packaging
0.0
Open Library
Open Library

Themes & subjects

Design and constructionPrinted circuitsSolder pastesSurface mount technologyElectronic packagingSolder and soldering
First published 1989

Author

Jennie S. Hwang

First published

1989

Pages

456

Read time

≈ 11h

Editions

4

Language

English

Publisher

Van Nostrand Reinhold

ISBN

9789401160506

Where to buy

TR
Amazon Bookshop

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